With the increase in heat dissipation from microelectronics devices and the reduction in overall form factors, thermal management becomes a more a more important element of electronic product design. Both the performance reliability and life expectancy of electronic equipment are inversely related to the component temperature of the equipment. The relationship between the reliability and the operating temperature of a typical silicon semi-conductor device shows that a reduction in the temperature corresponds to an exponential increase in the reliability and life expectancy of the device. Therefore, long life and reliable performance of a component may be achieved by effectively controlling the device operating temperature within the limits set by the device design engineers. Heat sinks are devices that enhance heat dissipation from a hot surface,usually the case of a heat generating component, to a cooler ambient, usually air.
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See Instructions for authors. Manufacturing Technology , 21 2 DOI: Welding techniques such as gas tungsten arc welding GTAW can induce solidification cracking owing to the wide solidification temperature range. Riveting or mechanical fastening are plausible alternatives, but can create problems like material loss, overall weight increase, corrosion, and introduction of high stress concentration areas.
A multidisciplinary, high impact journal devoted to publishing research of the highest quality and significance covering the science and application of all quantum-enabled technologies. Open all abstracts , in this tab. Marcello Benedetti et al Quantum Sci. Hybrid quantum—classical systems make it possible to utilize existing quantum computers to their fullest extent.